Qualcomm сегодня - это признанный лидер в области радиотехнологий на чипе по части 3GPP LTE. Процессоры и модемы Qualcomm используются в большинстве флагманских устройств, устройств премиального класса, да и не только в них.
Сегодня компания анонсирует платформу с поддержкой LTE-Advanced CA Cat.6 для обеспечения подключенности мобильных устройств со скоростью загрузки данных до 300 Мбит/с (возможность комбинации несущих общим объемом до 40 МГц).
Платформа построена на базе модемов Qualcomm Gobi 4G LTE, которые проверены в полевых условиях и во внедрениях B2C. Платформа обеспечивает поддержку LTE-Advanced FDD / TDD, а также 3G / DB/DC-HSPA+/WCDMA, EV-DO Advanced / Rev. B, TD-SCDMA. CDMA 1x Advances, GSM/EDGE). На ее базе можно будет строить планшеты и ноутбуки, которые смогут работать в самых разных странах.
Платформа основана на использовании чипсета Gobi 9x30 по технологии 20 нм (первый модем 20 нм с поддержкой Cat.6) в комбинации с чипом трансивера Qualcomm RF - Qualcomm WTR3925. Чипсет также поддерживает геолокационную платформу IZat. Кроме того, платформа поддерживает LTE Advanced Cat.6, две несущих HSUPA, включая двухдиапазонную поддержку HSPA+.
Платформа может использоваться в различных модулях для встраивания, включая форм-фактор M.2, LGA (land grid array). Она может работать под управлением таких ОС, как Android, Chrome OS, iOS, Windows. При использовании ее вместе с Qualcomm RF300 Front End Solution, можно обеспечить глобальное решение в рамках одного SKU LTE. Обеспечивается поддержка настройки антенн (antenna matching tuning), отслеживание пакетов (envelope tracking).
Новый чип, весьма вероятно, будет востребован прежде всего такими производителями планшетов и ноутбуков, как Dell, Fujitsu, Hewlett-Packard, Lenovo, Panasonic and Toshiba. Кроме того, чип могут покупать такие производители модулей, как Amtel, Foxconn, Huawei, Longcheer, Sierra Wireless, TCL и ZTE.
На стенде компании на MWC2014 (3E10) Qualcomm демонстрирует поддержку LTE-A Cat.6 на базе платформы с модемом Gobi 9x30.
Платформа может использоваться в самых разных странах мира за счет поддержки большого числа наборов диапазонов частот 3GPP
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Все, что стоит знать об MWC2014
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Press release Qualcomm
Qualcomm
Announces 4G LTE Advanced Category 6 Embedded Connectivity
Platform for Mobile Computing Products
— Fourth-generation
LTE multimode chipset doubles LTE data speeds up to 300 Mbps, deepens embedded
computing modem portfolio —
Qualcomm Incorporated (NASDAQ: QCOM) today
announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc.,
introduced the world’s first commercial 4G LTE Advanced embedded data
connectivity platform with Category 6 download speeds of up to 300 Mbps for
mobile computing devices, including thin form factor laptops, tablets and
convertibles.
The platform builds upon three generations of
Qualcomm® Gobi™ 4G LTE modems that have been field tested and proven for
consumer and enterprise mobility deployments, extending Qualcomm Technologies’
leadership in enabling 3G and 4G solutions that cover the broadest range of
cellular technologies and RF bands worldwide.
This includes LTE support, both TDD and FDD implementations with
backwards compatibility to HSPA+, EVDO, and TD-SCDMA—enabling notebook and
tablet manufacturers to offer a single product that works in multiple regions
around the world.
The depth and breadth of our Gobi embedded
computing modem portfolio allows PC OEMs and module vendors to pick the best
solution for virtually any of today’s most popular mobile computing products –
from high-end enterprise laptops to volume consumer tablets,” said Fram Akiki,
senior director of product management for Qualcomm Technologies, Inc.
“Qualcomm’s technologies also are making it easier than ever for users to do
more of what they want while on the go, whether it’s streaming 4K high-definition
video or quickly accessing enterprise applications from the cloud.
The Embedded Connectivity Platform is based on
Qualcomm Technologies’ fourth-generation 3G/LTE modem chipset, the Gobi 9x30,
and Qualcomm RF transceiver chip, the Qualcomm WTR3925. The WTR3925 also
incorporates the Qualcomm IZat™ location platform designed for delivery of
seamless, global location. Together, these solutions enable a powerful,
optimized single platform designed to deliver up to 2X faster LTE Advanced
along with dual carrier HSUPA and dual band multi-carrier HSPA+, designed to
help enable OEMs to launch LTE Advanced Cat 6 devices faster on a global scale,
offer significant improvements in performance and power consumption compared to
previous generations, and require less printed circuit board area for thinner,
sleeker designs.
Qualcomm Technologies’ Embedded Connectivity
Platform supports a broad range of embedded modules, including thin form
factors such as M.2, and Land Grid Array, and an expansive ecosystem of module
vendors who utilize a range of Gobi chipsets, from 3G to 4G LTE Advanced – and
support for leading operating systems such as Android, Chrome OS, iOS and
Windows. The platform also can be paired with the Qualcomm RF360™ Front End
Solution to enable a global, single-SKU LTE platform. Qualcomm RF360 Front End
Solution features proven commercial technologies such as antenna matching
tuning and envelope tracking which improves connection reliability plus power
efficiency for optimal performance.
PC vendors who currently offer notebooks and
tablets with built-in LTE technology based on Qualcomm Technologies’
second-generation LTE chipset, the Gobi MDM9x15, include Dell, Fujitsu,
Hewlett-Packard, Lenovo, Panasonic and Toshiba.
At Dell, we’re focused on helping our customers
do more and connect to any device, any application, anywhere, anytime,” said
Raza Haider, executive director, commercial PC group, client solutions,
Dell. “Qualcomm Technologies’ Gobi
embedded connectivity platform keeps our customers productive on the go with
its performance, efficiency and versatility in connecting to the fastest 3G /
4G LTE networks worldwide.
We’re continually striving to offer our
enterprise customers the very best mobile computing experience across a range
of form factors, from traditional laptops to hybrid tablets with touchscreens,”
said Jörg Hartmann’s, Vice President Client Computing Devices International
Business, Fujitsu. “Qualcomm Technologies’ Gobi embedded connectivity platform
plays an important role across that portfolio, enabling Fujitsu customers to
manage their critical data needs on the fastest 4G LTE connections wherever
they go.
Our ThinkPad laptops are known as the gold
standard in business computing for their exceptional engineering, performance
and industry-leading features,” said Jerry Paradise, Executive Director, WW
ThinkPad Product Marketing and Product Operations. “Gobi embedded solutions
allow us to offer the greatest range of 4G LTE connectivity options, keeping
our customers around the world mobile and connected.
Panasonic is continually pushing the wireless
capabilities of our mobile computers, which are depended upon by workers in
government and commercial enterprises throughout the world to acquire, manage
and interpret the information that drives innovation,” said Victoria Obenshain,
Vice President, Wireless Strategy, Panasonic System Communications Company of
North America. “Qualcomm Technologies’ industry-leading Gobi 4G LTE Advanced
embedded connectivity platform with potential download speeds up to 300 Mbps
will enable workers using Panasonic’s Toughbook and Toughpad solutions to improve
their productivity and efficiency by connecting faster and in more places than
ever before.
We’re choosing Qualcomm Technologies’ Gobi
embedded mobile connectivity platform for our computing products because of its
performance, power efficiency and ability to seamlessly connect across networks
– from 3G to 4G LTE,” said Matt McDowell, Marketing Director, Lifestyle
Products & Services division, Toshiba Europe GmbH. “These benefits ensure
that Toshiba customers will be able to stay connected in more places and get
the most out of their Toshiba devices.
Module vendors who will enable commercial device
launches include Amtel, Foxconn, Huawei, Longcheer, Sierra Wireless, TCL and
ZTE.
We’re pleased to be using Qualcomm
Technologies’ fourth-generation 3G/LTE multimode solutions in our upcoming
embedded modules and connectivity products,” Brand Cheng, SVP of Foxconn. “The
growth of 4G LTE networks worldwide is driving demand for faster and more
versatile connections on a range of mobile computing devices. Qualcomm’s
technology is well-equipped to meet that demand and lead the industry in
creating the next generation of innovative, connected devices.
In the mobile broadband field, Huawei provides
data card and module with fast and reliable connection for customers around the
world and provide customers the best and latest experience,” said Future Yang,
Vice president of MBB & Home Product Line of Huawei. “We develop our
products based on Qualcomm Technologies’ Gobi embedded computing modem platform,
which provides widest range of connectivity options including LTE advanced
Category 6 for blazing-fast download speed of up to 300 Mbps. We’ll release
data card, mobile WiFi, M2M module and automotive module based 9x30 in this
year.
We’re proud to offer the industry’s most
comprehensive portfolio of 2G, 3G and 4G LTE wireless embedded modules,” said
Dan Schieler, senior vice president, OEM Solutions for Sierra Wireless. “Such
depth and breadth is possible, in part, because of our collaboration with Qualcomm
and the Gobi embedded computing modem portfolio, which offers industry-leading
connectivity on the latest wireless standards.
Qualcomm Technologies’ embedded mobile
computing solutions deliver the industry’s best performance and power
consumption, and we’re excited to be implementing the latest 4G LTE Advanced
platform in our products,” said Ronald Hu, vice president of TCL Communication,
deputy general manager of Smart Connectivity Business Division.
Qualcomm Technologies’ broad embedded computing
modem portfolio – with connectivity ranging from 3G to 4G LTE Advanced –
enables us to offer wireless data router (mobile "hot spot") that
meet the needs of many different customers,” said Mr. Dongtang Zhu, ZTE vice
president of R&D. “ZTE is thrilled
to be Qualcomm Technologies’ launch customer for the Gobi 9x30 and WTR3925 and
is excited to be working with Qualcomm Technologies again to deliver even
faster LTE Advanced Category 6 speeds in our next-generation products.
Attendees at Mobile World Congress can view a
live demonstration of 300 Mbps LTE Advanced Category 6 using the Gobi 9x30
platform at the Qualcomm booth in Hall 3, Stand #3E10.
